Professional mechanical engineer with EE background and skills. Broad experience in hardware for getting the power in and the heat out, from milliwatt to megawatt systems, from chips and handhelds to supercomputers and data centers. 32 issued US patents primarily in microelectronic packaging, but others in fields as diverse as displays and wireless. Additional patents pending in novel and highly power-efficient data center architectures.

While he can take an ideal from concept to manufacturing, he offers the highest value to his clients in the early stages of their projects, helping them identify and solve their hardest problems, and creating valuable IP in the process.